Flip chip assembly outsourcing
The wafer size supports up to 12 inches. Consultations for chip sizes below 0.5mm are also available. It accommodates the formation of stud bumps in various shapes.
Our company offers "flip chip mounting," which can reduce the mounting area compared to conventional wire bonding. In the formation of stud bumps, we can customize the shape according to specifications. We are equipped to handle large wafers up to 12 inches. We possess extensive know-how and can accommodate inquiries for chip sizes below 0.5mm. We can also provide proposals that include processes following flip chip mounting. 【Features】 ■ Supports 6-inch, 8-inch, and 12-inch wafers ■ Capable of forming two-tier bumps for stud bumps ■ Supports bare wafers, tape-mounted wafers, and reconstructed wafers ■ Accommodates bump leveling *For more details, please refer to the materials. Feel free to contact us with any inquiries.
- Company：エスタカヤ電子工業
- Price：Other
